| Object Inspection |
Oblique/photographic backdrops for children's parties/wrong color/incomplete rollover/damaged/
High cold joint/insufficient solder/oversolder |
| Component Inspection |
0201 IC chip pitch 0.3mm, wave soldering point |
| Check method |
Color image comparison of IC text recognition short analysis, graphics, similarity analysis, color analysis, tan, gray analysis |
| Camera |
Color ccd (2m), resolution 15um, FOV 24*18mm, speed ≤ 2000 mm2/s |
| Light source |
Color (RGB) multi-angle cascade combination of LED lighting, high brightness, 2M pixels telephoto lens, DOV: 8mm |
| Feasibility test |
120 dots/sec; Scheduling time: 1-1.5 hr/1000 components, NG inspection ratio> 99%
Overhead reject rate: 005 - 3.0% (Repeat rate <3 items per set), False accept rate <0.01% |
| Label recognition |
2 touch points, support for multi-board multi-mark touch points, support for bad mark; Process speeds 0.5 sec/piece Free shipping |
| Computer |
Dual core 2.7G, DDR II 2.0G, 500G hard drive, 22" wide screen LCD |
| PCB Thickness |
0.3-5.0 (PCB curvature≤ 5mm) |
| PCB height |
Top: 30mm, bottom 35mm (can be customized upon customer request) |
| Drive method |
AC servo motor + ball screw rod + linear guide rail |
| Movement speed |
Max 700mm/s |
| PCB size |
380*380mm, auto-width |
| Conveyor height |
900 ± 20 mm |
| Power |
220V/50Hz, 650W, UPS, 1000 VA uninterruptible power supply |
| Compressed air |
Max 0.3MPa |
| Dimension |
980*1080*1410mm (signal light height not included); Signal lamp Height: 550 mm |
| Weight |
600 kg |
